| Papers and Articles Featuring Coolit |
Below is information about recent articles on Coolit, CoolitPCB, and CoolitDC as well as links to
the articles or their abstracts.
 Daat white paper, August 2019
Title: CFD modeling of experiment for power electronics
Authors: Daat staff engineers
Daat white paper, November 2018
Title: Benchmarking turbulence models for electronics cooling
Authors: Daat staff engineers
Daat white paper, May 2018
Title: Cooling QFP using phase change materials heat sink
Authors: Daat staff engineers
Daat white paper, December 2015
Title: Fast solution of cases with difficult fan curves
Authors: Jason Nielsen
Desktop Engineering Magazine, November 2015
Title: Editor's Pick: Coolit and CoolitPCB Version 15
Authors: Anthony Lockwood
Daat white paper, June 2014
Title: Cutting thermal design costs
Authors: Peggy Chalmers
The Communique, AFCOM's magazine for data center management professionals, May 2012
Title: Achieving low-cost optimal cooling
Authors: Eldad Levy
Data Center Post magazine, February 2012
Title: Keeping it cool, while
cutting costs
Authors: Eldad Levy and Sofi Stern
Bodo's Power magazine, pp. 40-41, May 2008
Title: Optimizing thermal solutions
Authors: Peggy Chalmers
Military & Aerospace Electronics magazine, July 2007
Title: CFD analysis delivers impressive savings for electronics thermal design
Authors: Ben Kuster
2006 IEEE COMPEL Workshop, Rensselaer Polytechnic Institute, Troy, NY, USA, July 16-19, 2006
Title: Steady State Electro-Thermal Modeling For DC-DC Converters
Authors: Rosa Ciprian, Brad Lehman.
Desktop Engineering magazine, v. 11, issue 10, June 2006
Title: CFD Shrinks the Thermal Design Process
Authors: Michael Staiano
Machine Design magazine, pp. 132-5, May 11, 2006
Title: Tilt the Modules and Shrink the Fans Says Thermal Software
Authors: Rod Boer, edited by Paul Dvorak
Military Imbedded Systems magazine, July 25, 2005
Title: Case Studies: Early warning for thermal problems
Authors: Ben Kuster and Peggy Chalmers
9th UK National Heat Transfer Conference, Manchester UK, September 2005
Title: Coolit thermal analysis of cooling solutions with heat pipes and TEC devices
Authors: Dr. Song Lin and John Broadbent
Machine Design, pp. 66-68, October 7, 2004
Title: A Better Way to Optimize Thermal Characteristics
Authors: Paul Dvorak
CAS Ltd. internal memo, September 2004
Title: OptimizeIt ensures optimum thermal design
Authors: Dr. Eldad Levy
COTS Journal, V. 5, No. 7, pp. 21-3, July 2003
Title: Embedded mesh boosts CFD performance
Authors: Dr. Eldad Levy
Proceedings - The 3rd International symposium on microelectronics and packaging, IMAPS Israel, June 2003
Title: A multitechnologies component thermal aspects
Authors: Eldad Levy
COTS Journal, V. 4, No. 11, pp. 31-38, November 2002
Title: Case Study: CFD Wages War on Electronic Systems' Heat
Authors: Ben Kuster
Machine Design, June 21, 2001, pages 69-71
Title: How to Use Parametric Features In Thermal Software
Authors: Arik Dvinsky. Edited by Paul Dvorak
Machine Design, April 5, 2001, pages 112 & 114
Title: Thermal Analysis Leads to Cool Designs
Authors: Jason Welch. Edited by Paul Dvorak
Mechanical
Engineering Magazine, v. 122, No. 7, pp. 78-9, July 2000
Title: Cooling Solution. A
surprise heat sink design prepares a computer manufacturer for the next
wave of hotter, faster CPUs.
Authors: ME staff writers in collaboration with outside
contributors from Intel and NEC Inc
ITherm Conference, Las
Vegas, Nevada, May, 2000.
Title: Thermofluid Analysis of Staggered and Inline
Pin Fin Heat Sinks
Machine
Design magazine, February 24, 2000. Title: Top tips for modeling electronics
Electronic Packaging and
Production, April 1999. Title: CFD Drives Down Design Cycle Time and Cost
Designfax, September
1998.
Title: Easy-to-use Desktop
Software Slashes Thermal Analysis Costs
Authors: Peggy Chalmers
Machine Design, April 2,
1998.
Title: Software Shows What's
Hot and What's Not in Enclosures
Authors: M. Staiano
SIAC Internal
Memorandum, February 9, 1998 Title: A comparative performance of turbulence models for
heat transfer in a backward facing step geometry
Authors: D. Niculin and M. Strelets
Desktop Engineering, v. 2(8), pp. 41-3, April 1997.
Title: Thermal Management of Electronic Equipment
Authors: A. Dvinsky
Num. Heat Transfer, v.30, pp. 703-720, November 1996.
Title: Navier-Stokes Study of Natural
Convection and Heat Transfer in Vertical Symmetrically Heated Plate-Fin
Heat Sinks
Authors: D.Niculin, M.Strelets, A. Dvinsky, A.
Bar-Cohen
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