` ` Coolit 3.0 Press Release
 
 

Daat Research Releases Coolit' v. 3.00

Windows-Based Software for Electronics Cooling

For Immediate Release

Hanover NH: Daat Research Corp. has released Coolit v. 3.00, Computational Fluid Dynamics (CFD) software for thermal analysis of electronic equipment. Coolit, which operates under Microsoft Windows 95 and NT on PCs, can predict airflow and heat transfer in packaged electronic equipment. Coolit’s introduction, two years ago, set new standards for ease-of-use for CFD software. Now thanks to Coolit, the powerful CFD technology, once the prerogative of "rocket scientists", is readily accessible for designers of electronics products. The new release of the software substantially advances this standard by further reducing problem set-up time and lowering the overhead associated with mastering the software. Designed for engineers who need to solve real-world electronic cooling problems but who do not have a lot of time to learn software, Coolit brings state-of-the-art CFD tools to the desktop. If ease-of-use means getting your products designed and manufactured reliably and on schedule then Coolit provides solutions on which you can depend.

Compared to previous versions, the new release provides:

1. Greatly enhanced versatility in the creation and placement of components:

Interactive creation of components and objects using both the mouse and tabular input. Components can be sized with the mouse. Components and objects can now be created separately to be later placed in Enclosure (as in the current version) or directly inside the Enclosure. You can now intersect components in Enclosure.

2. Hierarchical Model Creation

Components and complex objects assembled into a new object retain their individuality. Thus, for example, you can add a pin fin heat sink to a chip to create a chip assembly. You can later detach the heat sink as a whole.

3. "Drilling" feature

Placing an Open or a Fan component on an impermeable component such as Solid Block will automatically drill a hole in the Solid Block.

4. Improved Automatic Grid Generation

The automatically generated grid is be significantly improved as is the user interface to edit the grid. For example, now to add (remove) a grid line you have to select the place, click the right mouse button and press Add (Remove), for each grid line. The new version let’s you keep on adding (removing) lines by simply pointing and pressing the left mouse button.

5. Much improved Baffle component

Baffle is now a component that can be interactively rotated in Enclosure and can be placed at any angle.

6. Parametric Design Tools

Complex objects now have parameters attached to them that allow easy re-design by simply changing the parameters. For example, without removing the pin fin heat sink from Enclosure, you can simply change the pitch or pin height of all the pins, by adjusting the appropriate parameter.

7. Enhanced Component Snapping and Alignment

8. Add new circular cylinder and general polygonal extrusion components.

Dr. Arik Dvinsky, president of Daat Research, notes that, "As electronic products continue to shrink in size and increase in power, adequate thermal management has become an important element in product reliability. Software modeling of alternative designs reduces the time and effort invested in prototype building and testing, contributes to improved design, and helps optimize component characteristics and layout. Companies using software modeling tools such as Coolit, can take products from design to production in less time, and attain greater product reliability more cost effectively."

Coolit’s design is optimized for ease of use and fast evaluation of ‘what if’ scenarios. It provides a tightly integrated software environment allowing engineers to easily setup, compute and analyze design problems using point and click methodology. Coolit’s object-based graphical user interface provides interactive tools to create, assemble and package electronic components. Once the geometry of a problem is set up (or imported from a CAD application), the solution is computed by simply pressing the GO button - the finite volume grids and the solver are set up automatically. Of course, controls are available for expert users. The program displays results using a fully interactive graphics window. On-screen rotation, zoom in/out, movement and creation of new cross sections are controlled by point and click to easily identify problem areas. Live animation of the flow with simultaneous zoom in and rotation, further helps the design process.

Daat Research’s Coolit is the first and only CFD software package written and optimized specifically for electronics cooling applications and for Microsoft’s Windows. The result is a product that is readily usable on inexpensive desktop PCs, requires little time to learn, and produces accurate and reliable results. "Coolit’s main strength," Dr. Dvinsky added, "is that it enables engineers to quickly optimize the size, characteristics, and placement of critical components by ‘what if’ design iterations." For example, an engineer using Coolit can setup and solve a 50,000 cell model of a desktop computer from scratch in less than an hour on a Pentium II 300 PC. A ‘what if’ iteration of that design may take as little as five minutes to re-compute and display the results.

Daat Research was founded in 1992. In addition to developing Coolit, Daat Research has built a successful CFD consulting practice serving industry and government. Projects involve the development of advanced computer models for simulating fluid flow, heat and mass transfer, and related areas. Daat Research also offers customized solutions based upon Coolit.

For more information, contact Daat Research Corporation at 603-448-1302, fax 603-448-2941; email: info@daat.com; and visit our Web site at http:\\www.daat.com. Mail address is P.O. Box 5484, Hanover, NH 03755.

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For more information and to arrange a demonstration and interview, please contact Steve Rozov at 603 448-1302.

Coolit is a registered trademark of Daat Research Corp, of Hanover, NH.

 



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