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Accurate thermal predictions are critical during new product development because they impact
product design, schedule, and cost. During an Intel benchmark of two top CFD codes, Coolit
consistently delivered superior accuracy with predictions to within 5% of experiment.
Benchmarking was performed at an Intel lab and involved a confidential new product. Two cooling
systems with different forced airflow patterns were evaluated. Both flow configurations were assumed
laminar. Thermal parameters of the components and boards were taken from respective vendors. Only
main heat dissipating components were assessed in this study: the main chip and DDRs.
The predicted DDR temperatures were fairly close for both CFD packages, with Coolit predicting
somewhat cooler temperatures.
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DDR
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Predictions
for Flow Pattern - 1
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Predictions
for Flow Pattern - 2
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Coolit
(deg C)
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CFD#2 (deg C)
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Coolit (deg C)
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CFD#2 (deg C)
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#1
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88.4
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90.2
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74.0
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80.0
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#2
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89.9
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90.6
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76.0
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80.0
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#3
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90.5
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90.8
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77.3
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79.8
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#4
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90.1
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90.7
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77.8
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79.3
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#5
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88.8
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90.4
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77.7
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78.6
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Since the DDRs' predicted temperatures were close, initially only one measurement was done: DDR#4
for Flow Pattern 2 was measured at 73.9C vs. 77.8C predicted by Coolit and 79.3C predicted by the CFD
code #2.
With the main chip dissipating much more heat than a DDR, CFD prediction discrepancies came to the
fore. For Flow Pattern 1, Coolit predicted 109.4C and for Flow Pattern 2, 103.1C, both well
within the main chip's temperature maximum of 115.0C. Meanwhile, the CFD#2 software forecasted a
temperature of 115.0C and 139.7C, respectively. The actual (measured) temperature obtained for Flow
Pattern 2 turned out to be 98.7 C - just a few degrees away from the Coolit prediction of 103.1C and
41C below the CFD#2's prediction of 139.7C.
The benchmark test not only confirmed the accuracy of Coolit's predictions, but also demonstrated
the software's excellent performance in analyzing complex designs. The results identified the optimum
airflow design and confirmed that both designs would not exceed their temperature limits.
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