|
A manufacturer of LCD and plasma TVs could not
squeeze an adequate heat sink into the space available around a
critical 37 watts processor. As an alternative, UK thermal solution
provider, European Thermal Dynamics, Ltd (ETL) proposed a heat pipe
fin stack that would transfer heat from the component to a location
where a larger heat sink could be installed. The heat sink, in turn,
was to be air-cooled by natural convection and vented to the
ambient.
ETL selected thermal consultant, CE Technologies Ltd. to assess
the viability of the solution and optimize it for maximum cooling at
the lowest cost. Using components from the Coolit library, CET
quickly constructed a thermal model to prove design feasibility.
Then with the aid of Coolit's OptimizeIt module, the consulting firm
modeled heat pipe diameter and routing, optimized heat sink
parameters, evaluated and selected interface materials, and
determined the optimal vent configuration.
CET predicted that its optimized thermal solution would easily
hold the processor below its 85C maximum operating temperature
in a 35C ambient. Later physical testing confirmed that the
predictions were within 5% of the actual component case
temperatures.
|
