Papers and Articles
Papers and Articles Featuring Coolit

Below is information about recent articles on Coolit, CoolitPCB, and CoolitDC as well as links to the articles or their abstracts.


Daat white paper, June 2014

Title: Cutting thermal design costs
Authors: Peggy Chalmers


The Communique, AFCOM's magazine for data center management professionals, May 2012

Title: Achieving low-cost optimal cooling
Authors: Eldad Levy


Data Center Post magazine, February 2012

Title: Keeping it cool, while cutting costs
Authors: Eldad Levy and Sofi Stern


Bodo's Power magazine, pp. 40-41, May 2008

Title: Optimizing thermal solutions
Authors: Peggy Chalmers


Military & Aerospace Electronics magazine, July 2007

Title: CFD analysis delivers impressive savings for electronics thermal design
Authors: Ben Kuster


2006 IEEE COMPEL Workshop, Rensselaer Polytechnic Institute, Troy, NY, USA, July 16-19, 2006

Title: Steady State Electro-Thermal Modeling For DC-DC Converters
Authors: Rosa Ciprian, Brad Lehman.


Desktop Engineering magazine, v. 11, issue 10, June 2006

Title: CFD Shrinks the Thermal Design Process
Authors: Michael Staiano


Machine Design magazine, pp. 132-5, May 11, 2006

Title: Tilt the Modules and Shrink the Fans Says Thermal Software
Authors: Rod Boer, edited by Paul Dvorak


Military Imbedded Systems magazine, July 25, 2005

Title: Case Studies: Early warning for thermal problems
Authors: Ben Kuster and Peggy Chalmers


9th UK National Heat Transfer Conference, Manchester UK, September 2005

Title: Coolit thermal analysis of cooling solutions with heat pipes and TEC devices
Authors: Dr. Song Lin and John Broadbent


Machine Design, pp. 66-68, October 7, 2004

Title: A Better Way to Optimize Thermal Characteristics
Authors: Paul Dvorak


CAS Ltd. internal memo, September 2004

Title: OptimizeIt ensures optimum thermal design
Authors: Dr. Eldad Levy


COTS Journal, V. 5, No. 7, pp. 21-3, July 2003

Title: Embedded mesh boosts CFD performance
Authors: Dr. Eldad Levy


Proceedings - The 3rd International symposium on microelectronics and packaging, IMAPS Israel, June 2003

Title: A multitechnologies component thermal aspects
Authors: Eldad Levy


COTS Journal, V. 4, No. 11, pp. 31-38, November 2002

Title: Case Study: CFD Wages War on Electronic Systems' Heat
Authors: Ben Kuster


Machine Design, June 21, 2001, pages 69-71

Title: How to Use Parametric Features In Thermal Software
Authors: Arik Dvinsky. Edited by Paul Dvorak


Machine Design, April 5, 2001, pages 112 & 114

Title: Thermal Analysis Leads to Cool Designs
Authors: Jason Welch. Edited by Paul Dvorak


Mechanical Engineering Magazine, v. 122, No. 7, pp. 78-9, July 2000

Title: Cooling Solution. A surprise heat sink design prepares a computer manufacturer for the next wave of hotter, faster CPUs.
Authors: ME staff writers in collaboration with outside contributors from Intel and NEC Inc


ITherm Conference, Las Vegas, Nevada, May, 2000.

Title: Thermofluid Analysis of Staggered and Inline Pin Fin Heat Sinks


Machine Design magazine, February 24, 2000.

Title: Top tips for modeling electronics


Electronic Packaging and Production, April 1999.

Title: CFD Drives Down Design Cycle Time and Cost


Designfax, September 1998.

Title: Easy-to-use Desktop Software Slashes Thermal Analysis Costs
Authors: Peggy Chalmers


Machine Design, April 2, 1998.

Title: Software Shows What's Hot and What's Not in Enclosures
Authors: M. Staiano


SIAC Internal Memorandum, February 9, 1998

Title: A comparative performance of turbulence models for heat transfer in a backward facing step geometry
Authors: D. Niculin and M. Strelets


Desktop Engineering, v. 2(8), pp. 41-3, April 1997.

Title: Thermal Management of Electronic Equipment
Authors: A. Dvinsky


Num. Heat Transfer, v.30, pp. 703-720, November 1996.

Title: Navier-Stokes Study of Natural Convection and Heat Transfer in Vertical Symmetrically Heated Plate-Fin Heat Sinks
Authors: D.Niculin, M.Strelets, A. Dvinsky, A. Bar-Cohen


 

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