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Nokia AB has developed a series of benchmark tests for CFD codes.
The test shown here, involved a board mounted SO16 device.
The device was placed horizontally in the test chamber and it was
cooled by natural convection and radiation. The model included the
detailed internal architecture of the device: silicon chip, die,
leads internal and external, paddle and tie bar, and encapsulant.
The lab test was done for two SO16 devices to see variability in
the measurements. The Coolit test was run independently of the experiment
and without the knowledge of experimental results (blind). Only
after the computed results were delivered, the measured data were
communicated to engineers doing the Coolit analysis.
The results were as follows:
Coolit prediction:
T_junction = 76.85 C
Nokia experiment:
T_junction = 76.85 C and 79.45 C (corresponding to two experiments)
A detailed description of the experimental set up can be found
in Experimental Validation of Numerical Heat Transfer Predictions
for Single and Multi-Component Printed Circuit Boards in Natural
Convection Environments, Rodgers, et. al., 1999 Nokia Research
Center Memorandum.
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